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BGA Reballing and Fluxing Systems |
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XURB-S Universal Reballing Unit
The XURB-S set has is an independent heating system, a Hot Plate XURB-H matching the reballing fixture. This heating method allows for reflow of reballed IC in approximately 2 min., which is 2 to 3 times faster and better than on any other heating system. Specifically designed for XUR-S, the XURB-H unit has temperature controller with closed loop feedback, which guarantees proper heating rate and maximum temperature limit preventing reballed component damage. It also includes cooling fan, like no other unit in the industry to speed-up reballing time and make better quality solder balls. |
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XURB-SET Reballing Set allows solder balls to be restored to custom specified BGA or CSP components after residual solder has been removed. |
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X-BGA-DP Dipping Plate System Set This set facilitates application of paste flux (or paste) onto the balls under the BGA packages. The plates can be ordered to accommodate different component sizes and ball diameters. |
| Interested
Companies to distribute this product in their countries are welcome to contact: czes@bokar.com or call USA at (570) 842-2812 This is a tool which is designed to make SMT rework easier, less time consuming and properly done to guarantee appropriate process control. |
TO BUY
please see SMT Distributor in Your Country |